Neubiberg, Germany – October 15, 2012 – Infineon Technologies AG (FSE: IFX /OTCQX: IFNNY) today announced that its new Flash-based security controllers have been awarded with the highest security certificate (Common Criteria EAL 6+ (high)) by the Federal Office for Information Security (BSI). They are the world’s first Flashbased security controllers fulfilling these currently highest security standards. The new SOLID FLASH™ security chips with “Integrity Guard” are aimed at use in contactless and contact-based applications demanding highest security levels such as Government IDs, contactless payment transactions or embedded systems. They are the latest addition to the SLE 78 product family from Infineon with around 100 million units shipped worldwide.

 

“As a technology leader in the area of semiconductor-based security solutions, we have always set major trends in the industry,” says Dr. Stefan Hofschen, President of the Division Chip Card & Security at Infineon Technologies AG. “With our SOLID FLASH- based security controllers and the digital security technology ‘Integrity Guard’, we now offer the most modern contactless security controllers fulfilling the highest security standards.”

 

The new SOLID FLASH security ICs are based on Non Volatile Memory (Flash,EEPROM) technology and manufactured in 90nm process technology. In contrast to MASK ROM-based products, SOLID FLASH-based security controllers reduce time to market and can be flexibly programmed for various applications. Chip card manufacturers and system integrators can react faster to market changes, thanks to shorter delivery times and flexible product use.

 

The certified SOLID FLASH security controllers are based on the digital security technology “Integrity Guard” which has been developed for applications requiring highest security levels. It is based on mathematically describable security functions including complete encryption of the entire data path and a refined error-detection system with two central CPUs that continuously monitor each other. The innovative approach of the digital security technology “Integrity Guard” was also recently honored with the Nomination for the German Future Prize 2012 awarded by Germany’s Federal President for achievements in technology and innovation.

 

Additionally, the new security controllers offer very high communication speed of up to 6.8 Mbit/s (VHBR / Very High Bit Rate) for contactless applications. This allows shorten transaction times for payment and identification processes and reduced personalization cost for manufacturing cards and passports. Infineon is the first manufacturer of security ICs fulfilling the forward-looking VHBR standard. Further information about the SLE 78 products from Infineon is available at www.infineon.com/sle78

 

Further information about SOLID FLASH is available at www.infineon.com/solidflash

 

Further information about the Common Criteria certificate is available at www.bsi.bund.de

 

Security for the connected world

With its core competences in the areas of security, contactless communication and integrated microcontroller solutions (Embedded Control), Infineon offers a comprehensive portfolio of semiconductor security products for many chip card and security applications. With this expertise, Infineon is improving security in our increasingly mobile and connected world, for example for mobile payments, for system security and secure official electronic documents. Infineon has been developing innovative solutions in the area of chip-based security for over 25 years and has been a global market leader for the last 15 years.

 

Further information on chip card and security solutions from Infineon is available at www.infineon.com/chip-card-and-security

 

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2011 fiscal year (ending September 30), the company reported sales of Euro 4 billion with close to 26,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).

 

Further information is available at www.infineon.com
This news release is available online at www.infineon.com/press

Companies Website:
http://www.infineon.com/

Infineon Technologies News Release

• Infineon Technologies AG to Acquire International Rectifier Corporation forUS-Dollar 40 per share, approximately US-Dollar 3 billion in cash

  2014/08/21Infineon Technologies  Analog

• Infineon Shipped One Billion RF Switches for Smartphones and Tablets – Bulk RF CMOS Technology Captures Highest Growth Rates

  2014/06/27Infineon Technologies  Analog

• Infineon Again Global Leader in Power Semiconductors

  2012/10/12Infineon Technologies  Power Supply

• Infineon Introduces 5th Generation thinQ!TM SiC Schottky Barrier DiodesDelivering Market Leading Efficiency at Attractive Price-Performance Ratio

  2012/10/04Infineon Technologies  Power Supply

• Infineon’s innovative security technology “Integrity Guard” nominated for “Deutscher Zukunftspreis 2012”, the Federal President’s Award for Innovation and Technology

  2012/09/14Infineon Technologies  Analog

Related News Release

• Quobly Forges Strategic Collaboration with STMicroelectronics to Accelerate its Quantum Processor Manufacturing for Large-Scale Quantum Computing Solutions

  2024/12/24  STMicroelectronics  Processor/Memory

• Winbond’s LPDDR4/4X: A Green Solution for the Automotive Industry

  2024/11/29  Winbond Electronics  Processor/Memory

• STMicroelectronics reveals Page EEPROM two-in-one memory to boost smart-edge performance and efficiency

  2024/10/08  STMicroelectronics  Processor/Memory

• Winbond has unveiled its latest 1Gb QspiNAND for Wearable and Low-Power IoT Devices.

  2024/08/08  Winbond Electronics  Processor/Memory

• STMicroelectronics powers up the intelligent edge with second-generation STM32 microprocessors, bringing performance boost and industrial resilience

  2024/03/18  STMicroelectronics  Processor/Memory