SlimStack™ Fine-Pitch SMT Board to Board Connectors

Ideal for tight-packaging applications such as mobile phones, SlimStack™ fine-pitch connectors offer a wide selection of low-profile, narrow width options in various stack heights and circuit sizes for space savings and design flexibility

Slimstack™ high-speed micro-miniature board-to-board stacking connectors with speeds up to 20 Gbps and pitch sizes ranging from 0.35 to 1.00mm provide space-saving design flexibility that is ideal for a variety of wireless or portable applications in the Datacom, Telecom and Medical industries. Also available in hybrid signal/power versions that can deliver up to 3.0A of extra power through protective metal covers.

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://www.molex.com

Molex News Release

• Molex| ML-XT™ Sealed Connection System

  2015/08/14Molex  Passive / Connections / mechanical parts

• Molex and Newly-Acquired Oplink to Demonstrate Innovative Transmission and Transport Solutions at OFC 2015

  2015/04/21Molex  Company / Market Trends

• Impel™ Backplane Connector and Cable Assembly System

  2015/04/21Molex  Passive / Connections / mechanical parts

• Molex FPC Connectors, 0.30mm Pitch, SMT, Dual Contact, Easy-On™ BackFlip™ Actuator

  2015/03/24Molex  Passive / Connections / mechanical parts

• Molex Honored to Receive "Excellent Core Partner" Award 2014 from Huawei Technologies

  2015/01/23Molex  Company / Market Trends

Related News Release

• Bourns’ New AEC-Q200 Compliant, Automotive-Grade Thin Film Chip Resistors Offer Higher Resistance Tolerance Accuracy and TCR

  2024/10/03  Bourns  Passive / Connections / mechanical parts

• Bourns Announces AEC-Q200 Compliant Gas Discharge Tube Series for Enhanced Reliability in Demanding Environmental Applications

  2024/10/03  Bourns  Passive / Connections / mechanical parts

• Bourns Continues to Expand its Line of AEC-Q200 Compliant, Automotive Grade BMS Signal Transformers

  2024/10/03  Bourns  Passive / Connections / mechanical parts

• Bourns Introduces AEC-Q200 Compliant Automotive Grade Chip Inductor Series as Space-Saving Solution for Power over Coax Circuits

  2024/10/03  Bourns  Passive / Connections / mechanical parts

• Bourns Unveils Second-generation AEC-Q200 Compliant, Automotive Grade High Creepage/Clearance Distance Isolation Power Transformers

  2024/10/03  Bourns  Passive / Connections / mechanical parts