PCN/PDN/NRND Information AD9518-4ABCPZ|shopping sight of electronic components and semiconductor- chip one stop
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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2020/04/21 PCN (Product Change Notice) Product/Process Change Notice - PCN 20_0126 Rev. -
2020/08/26 PCN (Product Change Notice) Conversion of Select Sizes LFCSP Products from Punched to Sawn and Transfer of
Assembly Site to ASE Korea
2021/05/08 PCN (Product Change Notice) Conversion of Select Sizes LFCSP Products from Punched to Sawn and Transfer of
Assembly Site to ASE Korea
2021/05/08 PCN (Product Change Notice) Revision D : Add 9x9 AD5391QualificationResults Summary.
2025/05/30 PCN (Product Change Notice) Change of bond wire from Gold to Copper wire for LFCSP pkg family built in AEKC (ASE Korea).
Mold coumpound for LFCSP BOM will be changed to Sumitomo G700/EN4900-GC.
2025/05/30 PCN (Product Change Notice) Supplier Notice No.:PCN 25_0054 Rev. -
Title:
Gold wire to Copper wire Conversion (Notification)

Description Of Change:
Change of bond wire from Gold to Copper wire for LFCSP pkg family built in AEKC (ASE Korea).
Mold coumpound for LFCSP BOM will be changed to Sumitomo G700/EN4900-GC.
All materials have qualified and in production for ADI devices.

Reason For Change:
The conversion to Cu wire aligns with industry trend and ADI current and future corporate directives.
Note: ASE has been in Cu wire production for 10+ years and over billion units shipped to commercial and automotive customers.

Effectivity Date:
30-May-2025 (the earliest date that a customer could expect to receive changed material)
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PCN/PDN/NRND Information
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