2021/03/09 |
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PCN (Product Change Notice)
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2477 REV 3 – FINAL UPDATE : Additional Wafer Source (GFAB), Additional Assembly/Test (A/T) Site (SAT), and Transfer Assembly/Test Site to DIYI |
2022/04/04 |
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PCN (Product Change Notice)
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Fabrication Site Change
Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
Implementation Date: 4 April, 2022 |
2024/06/03 |
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PCN (Product Change Notice)
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Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products. |
2024/08/29 |
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PCN (Product Change Notice)
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Supplier Notice No.:PCN-2690 REV 1 Title: Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
DESCRIPTION OF CHANGE: This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified its subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as additional Assembly and Test site using PdCu wire with plating at Bandl for discrete products listed in the table below.
IMPACT: Continuity of Supply. No change in datasheet electrical parameters and product performance.
Implementation Date: 29 August, 2024 |