2020/09/15 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
2020/12/04 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION REV 2: This interim update provids a partial listing of affected part numbers for which qualification is complete for the changes listed in the title of the tables below. An additional Diodes internal assembly and test site (SAT) in Shanghai, China is also being added for products listed in table 4 below. Qualification / reliability reports are attached (embedded in this file). For other associated changes (identified in the Advance version (Rev 1) of PCN-2477 released August 17th, 2020) qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The final PCN is expected to be issued by January 31st, 2021 once all qualification has been completed. |
2021/03/09 |
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PCN(Product Change Notice)
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2477 REV 3 – FINAL UPDATE : Additional Wafer Source (GFAB), Additional Assembly/Test (A/T) Site (SAT), and Transfer Assembly/Test Site to DIYI |
2021/11/30 |
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PCN(Product Change Notice)
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Multiple Material Change Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package |