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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2023/09/21 PCN(Product Change Notice) Notice of Die Bond Material Change for H8, H8S and SH1/SH2 Family Surface Mount Package Products
Affected back-end production site: Outsourced semiconductor assembly & test sites ("OSAT")
Change: The die bond material is to be changed.
Effective Date: 1/1/2024
2024/01/01 PCN(Product Change Notice) Change of die bond material due to change of die bond material manufacturer
Termination of the material supply by the current die bond material manufacturer
2024/06/12 PDN(Product Discontinuation Notice) Supplier Notice No.:SAF-B-24-0011
Title:
End Of Life Notice(LTB_2025_06_30)

Overview:
The purpose of this notification is to communicate that Renesas Electronics hasbegun the End-of-Life (EOL) Process on select part numbers.
2024/06/13 PDN(Product Discontinuation Notice) We will notify you of the EOL of our products.
2025/01/16 PCN(Product Change Notice) The die bond material for H8, H8S, H8SX, and SH family surface mount package products will be changed.
Affected back-end processing base: Renesas Semiconductor (Suzhou) Co., Ltd
(hereinafter referred to as [Suzhou])
The die bond material to be changed will be a material
that has a proven track record in mass production at [Suzhou].

Scheduled start date of shipment: 5/1/2025
Click here for contact regarding final purchasing
PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

Product & Sales Information of products subject to notification

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Products: 1,218 out of cases/Show 1 to 25