KAWASAKI, Japan—Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched the "TRSxxx65H series,” the company’s third and latest[1] generation of silicon carbide (SiC) Schottky barrier diodes (SBDs) for industrial equipment. Volume shipments of the first 12 products, all 650V, start today, with seven products housed in TO-220-2L packages and five in DFN8×8 packages.

The new products use a new metal in a third generation SiC SBD chip that optimizes the junction barrier Schottky (JBS) structure[2] of the second generation products. They achieve industry-leading[3] low forward voltage of 1.2V (Typ.), 17% lower than the 1.45V (Typ.) of the previous generation. They also improve the trade-offs between forward voltage and total capacitive charge, and between forward voltage and reverse current, which reduces power dissipation and contributes to high efficiency of equipment.

Notes:

[1] As of July 2023.

[2] JBS structure lowers the electric field at the Schottky interface and reduces leakage current.

[3] As of July 2023, Toshiba survey.

Applications

・Switching power supplies

・EV charging stations

・Photovoltaic inverters

Features

・Industry-leading[3] low forward voltage: VF＝1.2V (Typ.) (IF=IF(DC))

・Low reverse current:

TRS6E65H  IR＝1.1μA (Typ.) (VR=650V)

・Low total capacitive charge:

TRS6E65H  QC＝17nC (Typ.) (VR=400V, f=1MHz)

Follow the link below for more on the new product.

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*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.