Taichung, Taiwan – 2024-12-11 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today unveils the TrustME® W77T Secure Flash family, specifically  designed  for  the  automotive  industry.  This  ISO26262  ASIL-D  Ready,  ISO21434 Certified, UNECE WP.29 and TISAX compliant Secure Flash is tailored to meet the demands of emerging automotive applications, such as software-defined vehicles (SDVs) and E/E systems, providing advanced protection for connected and autonomous vehicles. 

 

Operating  at  a  200MHz  Double  Transfer  Rate  (DTR)  on  the  industry-standard  Octal/xSPI interface,  the  W77T  delivers  a  read  bandwidth  of  up  to  400MB/s,  making  it  ideal  for automotive System-on-Chip (SoC) designs that require fast boot times and high-performance processing capabilities.  Available in a range of densities from 64Mb to 1Gb, the W77T is offered in TFBGA (Octal SPI), SOIC (Quad SPI) and WSON (Quad SPI) packages. It also features extended  Replay  Protected  Monotonic  Counters  (RPMC)  with  8  counters  for  PC  based implementation. Other advanced capabilities include JEDEC SPI CRC, JEDEC xSPI compatible interface, ECC, and is manufactured in our security certified fabrication facility to ensure a secure supply chain. 

 

As part of Winbond's TrustME® Secure Flash family, the W77T offers robust security features, including Post-Quantum Cryptography (PQC) capabilities for the security engine, NIST SP 800-193 compliant firmware resiliency, LMS-OTS (NIST SP 800-208) based remote attestation for secure  supply  chain,  Common  Criteria,  ISO21434,  FIPS  140-3  certification  and  ISO26262 Functional Safety requirements, ensuring vehicle safety, performance, and integrity. 

 

Winbond’s W77T Secure Flash is backward compatible with the popular W25Q NOR Flash and W77Q Secure Flash family and comes equipped with an arsenal of features designed to ensure Automotive security: 

・ Code  and  Data  Protection:  robust  protection  for  both  code  and  data,  making  it exceedingly difficult for hackers to tamper. Root of Trust implementation follows the TCG DICE attestation mechanism. 

・ Authentication:  Winbond  Secure  Flash  devices  employ  stringent  authentication protocols, ensuring that only authorized actors and software layers gain access.  

・ Secure  Software  Updates  with  Rollback  Protection:  the  devices  facilitate  remote secure software updates while safeguarding against rollback attacks, ensuring that only legitimate updates are executed. To maintain the highest level of security and integrity  during  software  updates,  W77T  employs  Leighton-Micali  Signature  (LMS) algorithms,  as  recommended  by  NIST  SP  800-208.  This  method  guarantees  the authenticity and integrity of the updating software, thereby providing an additional layer of security. 

・ Platform Resiliency: follows NIST SP 800-193 recommendations, unauthorized code changes are automatically detected, enabling the system to recover to a secure state and disturbing potential cyber threats.   

 

・ Secure  Supply  Chain:  Secure  Flash  ensures  the  integrity  and  authenticity  of  flash content throughout the entire supply chain. The W77T implements remote attestation based on LMS-OTS (NIST SP 800-208). This advanced approach effectively prevents content tampering and misconfiguration during platform assembly, transportation, and configuration, safeguarding against cyber adversaries. 

 

“We are excited to launch our most advanced Secure Flash product family- W77T Secure Flash,”  says  Winbond,  emphasizing  our  commitment  to  providing  safety  and  security  in automotive  flash  components.  “As  E/E  architectures  evolve  to  support  software-defined vehicle  designs,  security,  and  high  reliability  are  top  priorities  for  designers  and  vehicle manufacturers. The market will demand a high-performing, feature-rich, yet highly secure vehicle. The W77T is an effective solution for meeting these challenges and driving innovation in the automotive industry.” 

 

The 256Mb, 512Mb and 1Gb samples are available now, with 64Mb, 128Mb devices available 

shortly.  For  more  information  on  Winbond's  secure  products  and  solutions,  please 

visit https://www.winbond.com/hq/product/trustme/

Winbond Electronics Corporation is one of the few companies worldwide with proprietary products and technology in both memory and logic integrated circuits. The Company provides customer-driven solutions backed by the expert capabilities of product design, R&D, manufacturing, and promoting brand name products globally. Winbond’s product portfolio, consisting of Code Storage Flash, TrustME ®  Secure Flash, Customized Memory Solution (CMS), is widely used by tier 1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, China, Japan, Germany, India, Korea, Hong Kong, Singapore, and Israel. With its 12-inch fabs located in CTSP and South Taiwan Science Park (STSP)’s Kaohsiung Science Park, Winbond keeps pace to develop in-house technologies to provide high-quality integrated circuit products and services. 

 

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.