2022/10/12 |
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PCN(Product Change Notice)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2) Effectivity Date: 12-Oct-2022 |
2022/10/12 |
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PCN(Product Change Notice)
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Epoxy formulation change toHenkel 8290AfromHenkel 8290. EffectivityDate: 12-Oct-2022 (the earliest date that a customer could expect to receive changed material) |
2022/11/14 |
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PCN(Product Change Notice)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2) Rev. A 14-Nov-2022 14-Nov-2022 Adding additional parts Effectivity Date: 14-Nov-2022 (the earliest date that a customer could expect to receive changed material) |
2025/01/10 |
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PCN(Product Change Notice)
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Revision Description: Initial Release. Description Of Change: Migrating bottom trace code marking to top side package laser mark. Reason For Change: To standardize the marking method with other packages across the company and align with industry environmental initiatives. |
2025/01/10 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 24_0236 Rev. - Title: Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package
Description Of Change: Migrating bottom trace code marking to top side package laser mark.
Impact of the change (positive or negative) on fit, form, function & reliability: No impact to form, fit, function or reliability of the device.
Effectivity Date: 10-Jan-2025 (the earliest date that a customer could expect to receive changed material)
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