Newly Evaluated Products Offer Highest Operating Temperature in their Class

 

ALISO VIEJO, Calif., Jan. 7, 2016 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced qualification of its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs). In addition to outlining the criterion for electronic components to ensure that end systems meet automotive reliability levels, the grade 1 industry standard specification validates Microsemi's IGLOO™2 FPGAs as offering the highest junction temperature in its class―up to an impressive 125 degrees ambient (135 degrees Celsius junction).

 

"Our automotive-grade FPGAs offer the highest reliability and security in critical under-the-hood applications to ensure the safety of our customers' design, data and hardware," said Bruce Weyer, vice president and business unit manager at Microsemi. "In addition to providing the highest operating temperature, the IGLOO2 AEC-Q100 grade 1 FPGAs also provide the lowest total power in their class, enabling automotive designers to maximize their dynamic power budget in compact and high performance systems to deliver highly differentiated automotive solutions at the lowest total cost of ownership."

Microsemi's IGLOO2 FPGA devices, which also met industry standard specifications for grade 2 temperature range earlier this year along with Microsemi's SmartFusion2 system-on-chip (SoC) FPGAs, offer customers single event upset (SEU) immunity from neutron-induced firm errors, helping them achieve the zero defect rate essential for the automotive industry, as well as the company's award-winning security features and secure supply chain. These features address the most important design concerns for today's automotive designers. Microsemi's newly qualified devices are also the most suitable alternate to ASICs providing a low power, cost-effective, secure and reliable solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units.

Demand for high reliability in critical applications, ensuring zero-defect and tamper-free applications, continues to grow rapidly in the automotive industry. With an increase in security mandates amongst its customer base, Microsemi is the only vendor offering automotive-grade FPGAs at higher junction temperature, along with best-in-class security in low power and small footprint packages. 

"The automotive market for semiconductors is forecast to grow to $32.3 billion in 2016, from $30.3 billion in 2015, an increase of almost 7 percent," commented Colin Barnden, principal analyst at Semicast Research. "In comparison, we see the market for semiconductors in vehicle connectivity and ADAS growing at more than 20 percent in 2016. Microsemi's SmartFusion2 and IGLOO2 devices bring world class security features to the automotive industry and will address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobiles of the future."

Product Demonstrations in Booth W2-78 at CAR-ELE JAPAN
Microsemi will be showcasing its automotive-grade FPGAs at the upcoming CAR-ELE JAPAN International Automotive Electronics Technology Expo Jan. 13-15, 2016, with product demonstrations offered in Microsemi's booth, W2-78. The event, which will be held at Tokyo Big Sight in Tokyo, Japan, highlights a variety of industry-leading automotive electronics technologies such as components, materials, software, manufacturing equipment and testing technologies.

Availability
Microsemi's AEC-Q100 grade 1 IGLOO2 FPGAs will be available in March 2016 for mass production. For more information, visit http://www.microsemi.com/products/fpga-soc/automotive-grade-fpgas-socs or email sales.support@microsemi.com. For details on Microsemi's complete portfolio of offerings designed for the automotive industry, visit http://www.microsemi.com/applications/automotive.

About Microsemi's IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs deliver more resources in low density devices, with the lowest power, proven security and exceptional reliability. These devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microsemi FPGAs are used by customers in in Communications, Industrial, Medical, Defense, and Aviation markets. PCIe Gen 2 connectivity starts at just 10K logic elements (LEs). IGLOO2 FPGAs offer 5K-150K LEs with a high performance memory subsystem, up to 512KB embedded flash, 2 x 32 KB embedded static random-access memory (SRAM), two direct memory access (DMA) engines and two double data rate (DDR) controllers. Microsemi also offers a broad range of Military, Automotive and Space grade FPGAs and SoC FPGAs. For more information visit: http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga.

About Microsemi's Product Portfolio for Automotive Applications
Microsemi offers a diverse product and services portfolio for the automotive market, which includes: linear and angular motion inductive sensors interface integrated circuits (ICs), silicon carbide (SiC) MOSFETs, diodes and their modules, FPGAs and SoCs, audio processors and security software. For more information about Microsemi's solutions for automotive applications, visit http://www.microsemi.com/applications/automotive.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs), and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

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