Taichung, Taiwan – 2023-06-15 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the 8Mb 3V NOR W25Q80RV, the first of a new family of high performance, small form factor serial flash devices with higher read performance addressing the requirement of connected edge devices used in industrial and consumer applications.  

This  8Mb  density  Serial  Flash  produced  in  Winbond’s  own  12-inch  wafer  fabrication  facility  is manufactured using the latest generation of 58nm technology and is significantly smaller in size compared to its predecessor which was built using 90nm technology. The KGD (Known Good Die) and WLCSP (Wafer Level Chip Scale Package) versions of this latest device are ideal for use in variety of small-form-factor IoT devices.  

“The Internet of Things is expanding to 50 billion connected devices by 2023,” said Alan Niebel, president of WebFeet Research, an independent market-research firm. “Winbond's 3V 8Mb Serial Flash is suitable for both automotive and IoT segments. Overall, IoT is poised to grow in this new connected world with all shipments of Serial Flash totaling 12.9B units worldwide by 2027”. 

 

The company has been supporting the requirements of customers using the 8Mb Serial Flash with the  existing  generation  of  W25QxxDV  series  for  several  years  in  applications  including instrumentation,  networking,  PC,  printer,  automotive  and  gaming.  Now  the  time  has  come  to support these applications to include new use-cases such as wireless connectivity with KGD and  WLCSP solutions in advanced technology and with smaller lead frame packages. 

 

Winbond is a high volume provider of KGD solutions for more than 10 years. KGDs are fully baked and tested to have the same reliability level  as packaged products. They are ideal for stacking with MCUs  or  SoCs  requiring  high-speed  flash  access.  With  faster  read  speed  to  enhance  system performance, faster programing for efficient manufacturing and firmware OTA (Over-the-Air) update coupled with the smaller form factor aspect of SIP (system-in-package), this new 8Mb flash provides greater value for a variety of embedded systems. 

 

The W25Q80RV supports all popular single/dual/quad/QPI commands and read modes.  It is ideal for executing code (XIP) directly from flash as well as code shadowing to RAM.  This device operates on a single 2.7V to 3.6V power supply with power-down current down to 1μA.  The flash is organized as small 4KB sectors which allow for greater flexibility and storage efficiency in applications that require code, data and parameter storage. SPI clock frequencies of up to 133MHz Single Data Rate and  66MHz  Double  Data  Rate  are  supported.  The  Read  Command  Bypass  Mode  allows  faster memory access for true XIP (execute in place) operation. 

 

“Winbond is proud and committed to innovate and differentiate by designing our Serial Flash KGD and WLCSP solutions for use in specialized applications requiring small-form-factor and non-volatile storage for MCUs and SoCs,” said Jackson Huang, Flash Product Marketing Vice President, Winbond. 

“We continue to work closely with customers and add value for their next-generation embedded solutions.” 

 

W25Q80RV is available now. This will be followed by other densities in the family.  For specific details, please visit www.winbond.com. 

 

About Winbond 

Winbond  Electronics  Corporation  is  a  leading  global  supplier  of  semiconductor  memory  solutions.  The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer  electronics,  automotive  and  industrial,  and  computer  peripheral  markets.  Winbond  is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products. 

 

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.