2021/12/26 |
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PCN(Product Change Notice)
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Qualification of new Fab site (RFAB) & process technology (RFAB, LBC9) and BOM option |
2021/12/26 |
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PCN(Product Change Notice)
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Qualification of new Fab site (RFAB) using qualified Process Technology, Die Revision, and additional BOM option for select devices Current Fab Site Current Fab Site: SFAB Process: HCMOS Wafer Diameter: 150 mm
Additional Fab Site Additional Fab Site: RFAB Process: LBC9 Wafer Diameter: 300 mm
The die was also changed as a result of the process change.
Additionally, there will be a BOM option introduced for these devices: Bond wire diameter (Cu) Current: 0.96 mils Additional: 0.8 mils
Proposed 1st Ship Date: Dec 26, 2021 |
2022/05/18 |
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PCN(Product Change Notice)
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Datasheet for SNx4HC573A, SNx4HC240, SNx4HC273, SNx4HC374, and SNx4HC373 The datasheet number will be changing. |
2022/05/23 |
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PCN(Product Change Notice)
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Datasheet for SNx4HC573A, SNx4HC240, SNx4HC273, SNx4HC374, and SNx4HC373 Information Only PCN Re-issue PCN to correct the revision history for the SN74HC573A, SN54HC573A (lit# SCLS147) datasheet. |
2022/05/23 |
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PCN(Product Change Notice)
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Datasheet for SNx4HC573A, SNx4HC240, SNx4HC273, SNx4HC374, and SNx4HC373 The datasheet number will be changing. |