2020/04/17 |
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PCN(Product Change Notice)
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To add Pactech Malaysia as e‐NiPd pad plating site and UTAC Thailand as assembly site for Common Mode Filter devices in DFN package |
2022/04/26 |
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PCN(Product Change Notice)
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This is the final notification of the new bump site qualification in JCET formerly known as JCAP of the CMF dies.Change of polyimide is for product continuance. I-8124ER will no longer be produced by supplier. |
2022/04/26 |
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PCN(Product Change Notice)
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This is the final notification of the new bump site qualification in JCET formerly known as JCAP of the CMF dies.Change of polyimide is for product continuance. I-8124ER will no longer be produced by supplier. |
2025/12/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:IPCN25729XD Title: Wafer Fab Site Transfer from LA Semiconductor Idaho, United States to onsemi Bucheon, Korea for ESD and Surge Protection Products.
Description and Purpose: onsemi would like to notify its customers of its intent to qualify our ESD and Surge Protection Products at our onsemi Bucheon, Korea wafer FAB.
Proposed First Ship date: 01 Dec 2025 or earlier if approved by customer |