2023/05/16 |
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PCN(Product Change Notice)
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DDR3 SDRAM 4Gb & 8Gb (V00H) wafer fabrication will transfer to Micron's Fab 6 site with sample availability according to listed package type and temperature grade below.
Revision History: Revision 4, 2023-05-12: This document supersedes PCN #33095 Revision 3 dated 2022-02-18. The Last Shipment date has been extended from 2023-03-31 to 2024-03-31, and is also reflected in the PCN below. |
2024/04/23 |
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PCN(Product Change Notice)
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Supplier Notice No.:35347 Title: Micron Inner Box Label
Description: Micron is implementing several alterations to enhance the descriptive quality of the inner box label. These modifications exclusively pertain to the Micron inner box label and will not affect any custom labels. If you encounter this label type, please note the following changes: • Elimination of grid lines. • Revision of the barcode description from "(S) Serial" to "(3S) DN#” (Delivery Note Number). • Slight adjustments to barcode dimensions.
Target timeline for transition: Implementation will begin April 23, 2024.
Reason: Enhancements to Micron label for improved processing.
Anticipated Impact: None. |
2024/11/18 |
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PCN(Product Change Notice)
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Micron will be updating all packaging, DDR5 module and LPCAMM2 labels with the~new Micron logo. Any packaging, DDR5 module or LPCAMM2 labels printed after~2024-12-17 will have the new Micron logo. |