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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2020/08/13 PCN (Product Change Notice) Product/Process Change Notice
ADI is transferring some of the products currently manufactured using the 0.6μm BICMOS process from wafer fab facility located at 275 S.
Hillview Dr., Milpitas, CA, USA to Vanguard International Semiconductor, Taiwan. See Appendix 1 for the list of affected part numbers. The
affected products will be manufactured using ADI specified manufacturing flows, materials, process controls, and monitors ensuring no degradation of quality and reliability performance. No new products are being released in the Hillview wafer fab and all affected products will be transferred to the Vanguard wafer fab by the end of calendar year 2020 and will cease to be manufactured in the Hillview facility by February 2021.
2021/08/11 PCN (Product Change Notice) Notification of Wafer Fab Location Change for 0.6μm BICMOS Process Devices
from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan)
Effectivity Date: 30-Oct-2021
2022/10/11 PCN (Product Change Notice) Epoxy Change from Henkel 8290 to 8290A for MSOP Package
EffectivityDate: 11-Oct-2022 (the earliest date that a customer could expect to receive changed material)
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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