Joint news release by Infineon Technologies and Fuji Electric

 

Technology Media

 

May 9, 2012

 

Neubiberg and Nuremberg, Germany and Tokyo, Japan – May 9, 2012 – Fuji Electric Co., Ltd., and the chip manufacturer Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) serve the automotive industry by extending the supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV). Today at the PCIM Europe trade show (Nuremberg, Germany, May 8-10, 2012) the two companies announced their agreement on a joint common footprint for automotive IGBT power modules using the Infineon HybridPACK™ 2 power module. In response to the need for supply security for HEV power modules, Infineon and Fuji agreed on the size of the module, the position of pin-outs, the use of the pin-finned copper base plate and on other mechanical features. The agreement comprises the HybridPACK 2 module, the FS800R07A2E3 featuring 650V/800A.

 

“With the world-wide requirements for saving fossil fuel and increasing kilometer-per-liter, the demand for hybrid and electric vehicles will increase further. A reliable dual-source supplier base for power modules will be an important foundation for supporting the automotive industry to expand the lineup and the production of hybrid and electric vehicles,” said Toru Hosen, President of the Power Semiconductors division at Fuji Electric Co., Ltd. “This agreement also enables us to expand our product lineup.”

 

“In its ambition to make cars clean, safe and affordable Infineon developed power modules to enable the use of hybrid and electrical motors in all vehicle classes,” said Jochen Hanebeck, President of the Automotive division at Infineon Technologies AG. “The combination of our four decades of experience in power electronics and car electronics has resulted in our highly compact and reliable HybridPACK power modules. We are proud to serve the automotive industry with this agreement that caters for a reliable dual-source supplier base.”

 

Infineon developed its power modules HybridPACK 2 for direct liquid-cooled systems as common in hybrid vehicles and electrical vehicles. The HybridPACK 2 modules offer the industry’s smallest footprint at the given high power density. This is approximately 20 percent smaller than other modules on the market. Today’s electronic control systems for full hybrid cars and electrical vehicles equal the size of two standard shoe boxes, weighing an average of 30 kilos. A system with HybridPACK 2 power module technology is only about the third its size and only weighs approximately 20 kilos compared to other state-of-the-art solutions. The pin-finned copper base plate in HybridPACK 2 not only enhances thermal performance, but also increases reliability.

 

Availability

The HybridPACK 2 modules of Infineon are available in high-volume. Fuji plans to have power modules with HybridPACK 2 footprint available as of 2013.

 

Further information

Further information on Infineon’s automotive semiconductor portfolio, on its HEV products and power modules are available at www.infineon.com/automotive and www.infineon.com/hev and www.infineon.com/hybridpack

 

About Fuji Electric Co., Ltd.

Fuji Electric is one of the leading semiconductor manufacturers in the field of IGBT modules for industrial and automotive applications. With globally 23,500 employees of the Fuji Electric Group, the company is offering solutions for the improvement of the efficiency at the generation, transmission, distribution and consumption of electricity. The Semiconductor Group of Fuji Electric has a global sales network on all continents and Front- and Back-end manufacturing sites in Japan and overseas. Further information is available at www.fujielectric.com.

 

About Infineon

Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2011 fiscal year (ending September 30), the company reported sales of Euro 4.0 billion with close to 26,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com.

 

Further information is available at www.infineon.com
This news release is available online at http://www.infineon.com/cms/en/corporate/press/news/releases/2012/INFATV201205-039.html

Companies Website:
http://components-asiapac.arrow.com/en/new_product/4480/

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