March 7, 2016

 

TOKYO — Toshiba Corporation’s (TOKYO: 6502) Semiconductor & Storage Products Company today announced that it will showcase its leading-edge semiconductor and storage technologies and solutions at electronica China 2016. Toshiba will highlight solutions in three areas—Automotive, IoT and Industrial—under the unifying concept of creating a safe, secure and comfortable society. The trade fair for electronic components, systems and applications will be held at Shanghai New International Expo Centre(SNIEC) from March 15 to 17.

Outline of the Toshiba booth at electronica China 2016

Date:March 15 to 17, 2016

Venue:Shanghai New International Expo Centre(SNIEC)

Booth No:Hall E2. 2400

Main Exhibitions:
・Automotive:
Exhibits will spotlight Toshiba’s line-up of automotive semiconductors for use in Advanced Driver Assistance System (ADAS) solutions that support a safer driving experience. Leading-edge image processing technologies, including image recognition processors that can execute multiple functions simultaneously, and display controllers that can control head-up displays (HUD) and instrument clusters simultaneously, will be on display. Motor control technologies that support a safer driving experience will also be displayed.
 

・IoT:
Leading-edge products and solutions will underline Toshiba’s contributions to IoT, including memory and storage products that meet fast increasing demand for data explosion. Products on show will include “BiCS FLASH™”, the world’s first[1] 48-layer three dimensional stacked cell structure flash memory, and “BG1 Series” SSDs, the world’s smallest[2]. Other IoT solutions on display include “TransferJet™” close proximity wireless communication technology products; “FlashAir™” SDHC memory cards with wireless LAN; and “ApP Lite™” application processors.
 

・Industrial:
The latest line-up of Toshiba’s discrete power products and analog ICs offer features that contribute to an eco-friendly society. High efficiency, high performance discretes will include high power IGBT modules for railroads, power transmission & distribution and inverter systems; next-generation power products using SiC; and low power loss MOSFETs that lower power consumption in electronic devices. Motor control solutions that cut power consumption and also reduce end-product development time will also be featured.

Notes:

[1] As of March 26, 2015. Toshiba survey.

[2] As an NVMe™ PCIe® interface SSD, as of March 7, 2016. Toshiba survey.

* BiCs FLASH, FlashAir and ApP Lite are trademarks of Toshiba Corporation.

* TransferJet is a trademark licensed by the TransferJet Consortium.

* NVMe is a trademark of NVM Express, Inc.

* PCIe is a registered trademark of PCI-SIG.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp160308&no=02

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• Winbond Introduces the New Automotive-qualified W77T Secure Flash Memory

  2024/12/12  Winbond Electronics  Automotive

• STMicroelectronics’ octal automotive gate driver with patented features reducing motor-drive bill of materials cost

  2024/12/10  STMicroelectronics  Automotive

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13  Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01  Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28  Toshiba  Automotive