– Equipped with two 10Gbps Ethernet AVB/TSN ports and three PCIe® Gen 3 switch ports –

January 12, 2022

 

KAWASAKI, Japan—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added “TC9563XBG” to its line-up of Ethernet bridge ICs, to provide support for 10Gbps communications in automotive information communications systems and industrial equipment. Sample shipments have started and volume production will start in August 2022.

Automotive networks are evolving toward zone architecture[1], where communications between zones use real-time, multi-gig[2] transmission via Ethernet at a rate of 1Gbps or higher.　The new bridge IC has Toshiba’s first 2-port 10Gbps Ethernet, and the interface can be selected from USXGMII, XFI, SGMII, and RGMII[3]. The two ports support Ethernet AVB[4] and TSN[5], which facilitate real-time processing and synchronous processing, respectively. They also support “simplified” SR-IOV (virtual functions)[6]. The combination of these features in the new product delivers solutions suited to next-generation automotive networks.

As the speeds of communications devices continue to increase, the new IC can be used not only for zone architecture but also for various automotive applications such as IVI and telematics, and also in industrial equipment. It is also postioned to be a successor to current TC9560 and TC9562 series products supporting 1Gbps Ethernet.

In recent years, more and more devices have been equipped with PCIe interfaces for device-to-device communications, such as Wi-Fi®, and the host SoC tends to run short of PCIe interfaces. TC9563XBG has three PCIe Gen 3 switch ports for communications with the host SoC and connection to devices equipped with PCIe interfaces. The PCIe switch part is configured with one 4-lane upstream port for connection with the host SoC and two 1-lane downstream ports for connection to devices with a PCIe interface. Using the 3-port PCIe switch function for connections to such devices can help mitigate PCIe interface shortages.

TC9563XBG will be AEC-Q100 Grade 3[7] qualified.

Notes:
[1] Zone architecture: A network configuration expected to be used for next generation automotive networks, in which a vehicle is divided into multiple zones that communicate with each other at high speeds for collaborative operation.
[2] Multi-gig: Multi-Gigabit Ethernet (2.5Gbps to 10Gbps). Recent automotive networks require a bandwidth larger than 1Gbps.
[3] USXGMII, XFI, SGMII, RGMII: Standards for Ethernet interfaces. USXGMII = Universal Serial 10 Gigabit Media Independent Interface; XFI = 10 Gigabit serial Interface; SGMII = Serial Gigabit Media Independent Interface; RGMII = Reduced Gigabit Media Independent Interface.
[4] Ethernet AVB: IEEE802.1 Audio/Video Bridging. A standard for handling audio and video data using Ethernet standard technology.
[5] Ethernet TSN: IEEE802.1 Time-Sensitive Networking. A standard for data transmission with lower latency than AVB.
[6] SR-IOV: Single Root I/O Virtualization. A standard that supports virtualization on PCI devices.
[7] AEC-Q100 Grade 3: Test standards formulated by the automotive industry for certifying reliability of ICs.

Applications
•Automotive infotainment
•Automotive telematics
•Automotive gateways
•Industrial equipment

Features
•2 10Gbps Ethernet ports (selectable from USXGMII, XFI, SGMII or RGMII)
•3 PCIe Gen3 switch ports
•To be AEC-Q100 Grade 3 qualified.

Follow the link below for more on the new products.
https://toshiba.semicon-storage.com/ap-en/company/news/news-topics/2022/01/automotive-20220112-1.html?utm_source=chip1stop&utm_medium=webmedia&utm_campaign=jp&cid=jp-chip1stop

*Company names, product names, and service names may be trademarks of their respective companies.
*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Companies Website:
https://toshiba.semicon-storage.com/ap-en/company/news/news-topics/2022/01/automotive-20220112-1.html?utm_source=chip1stop&utm_medium=webmedia&utm_campaign=jp&cid=jp-chip1stop

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• STMicroelectronics’ failsafe comparators with guaranteed start-up time boost reliability and power savings

  2024/12/03  STMicroelectronics  Analog

• Flexible, space-saving class-D amplifier for in-car audio, from STMicroelectronics, adds automotive-optimized diagnostics

  2024/09/30  STMicroelectronics  Analog

• ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

  2024/04/23  STMicroelectronics  Analog

• STMicroelectronics’ SiC-based digital power solution selected by Compuware for high-efficiency and reliable server power supply

  2024/04/02  STMicroelectronics  Analog

• STMicroelectronics boosts silicon power performance with automotive-grade MDmesh DM9 super-junction MOSFETs

  2024/03/18  STMicroelectronics  Analog