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PCN/PDN/NRND Information

PCN (product/process change notification) and PDN (production discontinuation notification) information.

Notification Date Notification Documents Notification Type Notification Information
2022/02/13 PCN (Product Change Notice) Qualification of HFTF as additional Assembly site for select devices
2022/04/14 PCN (Product Change Notice) Qualification of HFTF as additional Assembly site for select devices

Revision A is to update the description of change to include a change in mold compound for the proposed change.
We apologize for any inconvenience this may have caused.

Proposed 1st Ship Date: Apr 14, 2022

ASESH HFTF
Mold Compound EN2000763 R-30
2024/04/22 PCN (Product Change Notice) Texas Instruments Incorporated is announcing
the qualification of additional Assembly sites for devices listed below in the product affected section.

Proposed 1st Ship Date: July 17, 2024
2024/06/26 PCN (Product Change Notice) Qualification of RFAB using qualified Process Technology, Die Revision & BOM~option for select devicess
2024/07/01 PCN (Product Change Notice) Supplier Notice No.:20240625003.0
Title:
Datasheet for TCA9617A

Description of Change:
Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated as summarized below.

The datasheet number will be changing.
Device Family/TCA9617A Change From: SCPS244BChange To:SCPS244C

Reason for Change:
To accurately reflect device characteristics.

Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
No anticipated impact. This is a specification change announcement only. There are no changes to the actual device
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PCN/PDN/NRND Information
Notification Type
Notification Information
Notification Date
Products subject to notification
Manufacturer Manufacturer Part Number Last Time Buy Successor Products

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