LFPAK88 MOSFETs

Building on 15 years experience in copper-clip package production, Nexperia enhances the market-leading LFPAK range with the addition of LFPAK88. Providing up to 23 times power density compared to wire bond alternatives, and the robust and reliable characteristics synonymous with Nexperia’s LFPAK technology, LFPAK88 is ideally suited for high-power industrial applications. Also qualified to AEC-Q101 standards it provides the perfect solution for automotive power steering, reverse battery protection, and DC/DC conversion applications.

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