January 6, 2016

Chipset enables automotive Ethernet-AVB for next-generation IVI and telematics

TOKYO– Toshiba Corporation's (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of an automotive-grade Ethernet bridge solution for in-vehicle infotainment (IVI) and other automotive applications. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav, generally referred to as Ethernet-AVB. The Ethernet-AVB standard enables stable, reliable multimedia transmissions, making it suitable for IVI and telematics.

Sample shipments of the TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, start today, with volume production slated for October 2016.

Automotive electronics are becoming more complex with the addition of advanced sensors, high-resolution displays, on-vehicle cameras, automated driver assistance systems (ADAS), and their data transmission and controls. Connecting these devices with an industry-standard Ethernet protocol contributes to simplified wiring, cost savings, reduced harness weight and improved mileage. Toshiba’s new automotive-grade Ethernet solution also supports Ethernet-AVB, which is an important factor for multimedia applications. In addition, the device will be AEC-Q100[1] qualified to ensure performance in rigorous automotive environments.

Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120 million nodes by 2020[2], driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.

Connected to an application processor or other system-on-chip (SoC) host, the TC9560XBG allows the host device to deliver audio, video, and data information through the 10/100/1000 Ethernet network in an automotive environment. Connection to the host is achieved via PCI Express® (PCIe®), HSIC or Time Division Multiplex (TDM)/I2S for audio traffic. The IC’s RGMII/RMII[3] interface connects to the Ethernet switch or PHY device, and both AVB and legacy traffic are supported. An on-chip ARM® Cortex®-M3 processor can perform system control and management.

The new chipset will be showcased at the 2016 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.

Main Specifications

 

Notes:

1.AEC-Q100 refers to the stress test qualification for ICs established by the U.S.-based Automotive Electronics Council, which sets qualification standards for all electronics components supplied to the automotive industry. Grade 3 refers to ambient operating temperature range of -40°C to +85°C.

2.“Automotive Ethernet Market Growth Outlook,” Strategy Analytics, Oct. 23, 2014.

3.Fast Ethernet interfaces: RGMII = Reduced Gigabit Media Independent Interface; RMII = Reduced Media Independent Interface. Support is planned for MII (Media Independent Interface).

*PCI Express and PCIe are registered trademarks of PCI-SIG.

*ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.

For more information about the new product, please visit:

http://toshiba.semicon-storage.com/ap-en/product/automotive/interface-bridge.html?mm=cp160106&no=05

*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞

http://toshiba.semicon-storage.com/ap-en?mm=cp160106&no=06

 

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Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp160106&no=06

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