TAICHUNG, Taiwan—2023-08-08 Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, is pleased to announce that their W77Q Secure Flash family has received the prestigious ISO/SAE 21434 international standard certification. This certification is important for all OEMs to the automotive industry, and Winbond has now become the first Flash vendor worldwide to achieve this standard certification to meet global regulatory requirements.

The ISO/SAE 21434 standard, titled "Road vehicles - cybersecurity engineering," is an industry standard developed by the International Organization for Standardization (ISO) and the SAE International. It focuses on protecting road users by outlining requirements to ensure the robustness  of  automotive  systems  against  cyber-attacks.  This  standard  applies  to manufactured  road  vehicles  and  cybersecurity-related  subcomponents,  including  IC components.  Compliance  with  UNECE  R155  is  necessary  to  obtain  EU-Type  approval  and vehicle approval through GSR. 

 

The ISO/SAE 21434 Cybersecurity Product Certification for Winbond's W77Q Secure Flash family encompasses several key elements: 

  

•  Rigorous risk assessment and management processes to identify vulnerabilities and threats, enabling effective mitigation strategies. 

•  A systematic approach to cybersecurity throughout the entire product development lifecycle, integrating security into every aspect. 

•  Extensive testing and validation to verify robustness against potential cyber threats, ensuring the effectiveness of the products in protecting against attacks. 

•  Ongoing  monitoring  and  improvement  of  cybersecurity  practices  to  stay  ahead  of emerging threats and vulnerabilities. 

 

Winbond  takes  pride  in  being  the  first  Specialty  memory  IC  manufacturer  to  receive  this Automotive  CyberSecurity  certification.  This  ISO/SAE  21434  certification  showcases Winbond's  commitment  to  meet  and  exceed  global  cybersecurity  standards,  providing assurance to  automotive  clients  that their  products  are designed  and manufactured with utmost attention to cybersecurity vulnerabilities and risks. 

 

In addition to the ISO/SAE 21434 certification, Winbond's TrustME ®  W77Q Secure Flash has already  obtained  other  industry-recognized  security  and  safety  certifications,  including Common Criteria EAL2+, SESIP level 2, FIPS CAVP and CMVP, and ISO 26262 ASIL-C Ready. These certifications enable the TrustME W77Q Secure Flash to meet the emerging demands in safety and cybersecurity for automotive applications. 

 

Winbond's dedication to cybersecurity is supported by TUV, “We warmly congratulate you on this  achievement  and  are  excited  to  serve  Winbond  as  a  leading  manufacturer  of  their advanced products with our assessment and certification services. With the acquisition of the ISO/SAE 21434 Certificate, Winbond claims to be State-of-the-Art with its products”, says Bernd Püttmann, TÜV NORD. 

 

“Winbond’s compliance with the ISO/SAE 21434 Road vehicles - cybersecurity engineering  Certification  reinforces  our  position  as  a  trusted  provider  of  secure  solutions  for  the automotive  market.  This  certification  highlights  our  commitment  to  maintaining  the confidentiality,  integrity,  and  resilience  of  customers'  data  and  applications,  safeguarding critical  information  from  unauthorized  access  or  exploitation.  Winbond  believes  that cybersecurity  is  a  collective  responsibility  and  remains  at  the  forefront  of  cybersecurity innovation to ensure a secure digital ecosystem for our customers and partners”, says Ilia Stolov, Technology Executive of Winbond. 

 

With  our  Product  Longevity  Program  (WPLP)  offering  long-term  support  for  automotive applications, Winbond is the preferred memory provider worldwide. For more information on Winbond's products and solutions, please visit www.winbond.com. 

 

  About Winbond 

Winbond  Electronics  Corporation  is  a  leading  global  supplier  of  semiconductor  memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers incommunication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products. 

 

Winbond  is  a  registered  trademark  of  Winbond  Electronics  Corporation.  All  other  trademarks  and  copyrights mentioned herein are the property of their respective owners. 

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