October 17, 2023

KAWASAKI, Japan—Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched "TLP3475W," a photorelay in a small, thin WSON4 package. It reduces insertion loss and suppresses power attenuation in high-frequency signals [1] and is suitable for the pin electronics of semiconductor testers, which use a large number of relays and require high-speed signaling. Volume shipments start today.

Toshiba’s optimized package designs reduces parasitic capacitance and inductance in the new photorelay. This reduces insertion loss and improves the transmission characteristic of high-frequency signals to 20GHz (typ.) [2], about 1.5 times lower [2] than Toshiba’s current product, TLP3475S.

TLP3475W uses a small, thin WSON4 package that is only 0.8mm (typ.) thick, making it the smallest [3] photorelay in the industry to realize improved high-frequency signal transmission characteristics. It is 40% lower in height than Toshiba’s ultra-small S-VSON4T package, allowing more products to be mounted on the same circuit board, and will contribute to improved measuring efficiency.

Toshiba will continue to expand its product line-up to support semiconductor testers that deliver higher speeds and greater functionality.

Applications

・Semiconductor testers (high-speed memory testers, high-speed logic testers, etc.)

・SProbe cards

・SMeasuring equipment

Features

・SIndustry’s smallest [3] WSON4 package: 1.45mm×2.0mm (typ.), t=0.8mm (typ.)

・SImproving to pass the high-frequency signals: f=20GHz (typ.) @Insertion loss(S21) = -3dB

・SNormally open function (1-Form-A)

Notes:

[1] When the frequency band is in the range of several hundreds of megahertz to several tens of gigahertz.

[2] The frequency band where the power attenuation ratio (insertion loss) when the signal passes through the output MOSFET is -3dB.

[3] For photorelays. As of October 2023, Toshiba survey.

Follow the link below for more on the new product.

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*Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.