| 2021/02/25 |
|
PCN(Product Change Notice)
|
Information Concerning IXYS Integrated Circuits Division Migration to Littelfuse SAP |
| 2024/06/06 |
|
PCN(Product Change Notice)
|
Supplier will comfirm devices affected and provide a list of devices actually~converting |
| 2024/06/13 |
|
PCN(Product Change Notice)
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Supplier Notice No.:PCN47-IDM-24 Title: Carling Passivation and Plating Supplier Transition
Description of the Change: We will be transitioning away from the supplier who performed metal component passivation and plating processes on the attached finished goods.
Reason for The Change: The current supplier of these services has informed us that it is no longer in their strategy to provide such services on the components we require.
Effective Date of the Change: This will be conducted as a running change, effective immediately. |
| 2024/06/21 |
|
PCN(Product Change Notice)
|
Supplier will comfirm devices affected and provide a list of devices actually~converting |
| 2025/07/16 |
|
PCN(Product Change Notice)
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PDN No.: PCN EIC-1153 Description: Additional Epoxy Mold Compound Qualification for selected 8L DIP and SMT package type devices |
| 2025/12/30 |
|
PCN(Product Change Notice)
|
PCN No.:EIC-1159 Change Desc.:Back Side Metallization change
Effective date: December 30, 2025 |