CUI Further Expands Thermal Management Portfolio with New Line of Heat Sinks chip one stop

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CUI Further Expands Thermal Management Portfolio with New Line of Heat Sinks

2017/06/05CUI Passive / Connections / mechanical parts

05/30/2017

CUI’s Thermal Management Group today announced an expansion to its existing portfolio of Peltier devices and dc fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, is compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. Designed to improve the heat dissipation of low and high power board level applications, these stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems.

The extruded and stamped heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.

Along with their standard form factors and sizes, CUI also offers a range of custom heat sink capabilities. With alternate production methods such as forging and die casting as well as extrusions and stampings, CUI can create virtually any shape or profile to fit specific design needs. A variety of additional materials and finishes are available, including clear and color anodization, chromate powder coating, and nickel or zinc plating. Hole punching for custom mounting patterns is also an option. In addition, CUI’s standard or custom heat sinks can be integrated with any of its current Peltier and dc fan offerings to achieve more complex thermal solutions.

“At CUI, we see the development and expansion of our thermal management product line as a natural complement to our industry leading portfolio of power products,” stated Kraig Kawada, CUI’s VP of Product Management. “As the heat in applications continues to rise due to increasing power densities, we believe that the introduction of these heat sinks, along with our current Peltier devices and dc fans will assist our customers in meeting their growing thermal management challenges.”

Summary
Product name: Heat sinks
Availability: Stock to 7 weeks
Possible users: Low and high power board level applications
Primary features: Variety of standard form factors and sizes, custom options available

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