CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) 

and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate 

and fan-out solutions. Designed to meet the growing demands of cloud-based AI servers, it 

is compatible with memory density from 256Mb to 8Gb with a single die, and it can also be 

3D stacked to enhance bandwidth while reducing data transfer power consumption.  

 

Winbond is taking a major step forward with CUBE, enabling seamless deployment across 

various platforms and interfaces. The technology is suited to advanced applications such as 

wearable and edge server devices, surveillance equipment, ADAS, and co-robots.  

 

"The CUBE architecture enables a paradigm shift in AI deployment," says Winbond. "We 

believe that the integration of cloud AI and powerful edge AI will define the next phase of AI development. With CUBE, we are unlocking new possibilities and paving the way for 

improved memory performance and cost optimization on powerful Edge AI device." 

 

CUBE's key features include: 

⚫  Power efficiency: CUBE delivers exceptional power efficiency, consuming less than 

1pJ/bit, ensuring extended operation and optimized energy usage. 

⚫  Superior performance: With bandwidth capabilities ranging from 32GB/s to 

256GB/s per die, CUBE ensures accelerated performance that exceeds industry 

standards. 

⚫  Compact size: CUBE offers a range of memory capacities from 256Mb to 8Gb per 

die, based on the D20 specification now and D16 in 2025. This allows CUBE to fit 

into smaller form factors seamlessly. The introduction of through-silicon vias (TSVs) 

further enhances performance, improving signal and power integrity. Additionally, 

it reduces the IO area through a smaller pad pitch, as well as heat dissipation, 

especially when using SoC on the top die and CUBE on the bottom die. 

⚫  Cost-Effective Solution with High Bandwidth: Achieving outstanding cost-

effectiveness, the CUBE IO boosts an impressive data rate of up to 2Gbps with total 

1K IO. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE 

unleashes ultra-high bandwidth capabilities, reaching an astounding 32GBs-

256GB/s (=HBM2 Bandwidth), equivalent to harnessing the power of 4-32pcs*LP-

DDR4x 4266Mbps x16 IO bandwidth. 

⚫  Reduction in SoC Die Size for Improved Cost Efficiency: By stacking the SoC (top die 

without TSV) atop the CUBE (bottom die with TSV), it becomes possible to minimize 

the SoC die size, eliminating any TSVpenalty area. This not only enhances cost 

advantages but also contributes to the overall efficiency include small form factor 

of Edge AI devices. 

 

"CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, 

response time, and energy efficiency," Winbond added. "Winbond's commitment to 

innovation and collaboration will enable developers and enterprises to drive advancement 

across various industries." 

 

Winbond is actively engaging with partner companies to establish the 3DCaaS platform, 

which will leverage CUBE's capabilities. By integrating CUBE with existing technologies, 

Winbond aims to offer cutting-edge solutions that empower businesses to thrive in the era 

of AI-driven transformation. 

 

About Winbond 

Winbond Electronics Corporation is a leading global supplier of semiconductor memory 

solutions. The Company provides customer-driven memory solutions backed by the expert 

capabilities of product design, R&D, manufacturing, and sales services. Winbond's product 

portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® 

Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, 

automotive and industrial, and computer peripheral markets. Winbond is headquartered in 

Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, 

Winbond keeps pace to develop in-house technologies to provide high-quality memory IC 

products. 

 

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned 

herein are the property of their respective owners.