2020/09/08 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
2020/09/09 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
2020/10/01 |
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PCN(Product Change Notice)
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MCU/SOC (GP products) announcement of Full carton |
2021/04/01 |
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PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing change from Fractional Tray to Full Carton : Shipments from REA of devices in Full Cartons begins. October 1, 2020 |
2021/04/01 |
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PCN(Product Change Notice)
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RE-PROCESSED to include LTB Date to 4/01/2021 for packing form with a tray from fraction to Full Carton (full packing) : Full Carton shipment will become standard, combining max. 3 lot codes worst case |
2023/06/09 |
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PCN(Product Change Notice)
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Notice of material change for RX Family LFQFP/LQFP products Change the die bond and resin material. The changed material will be a material that has a proven track record in RSB assembly.
Estimated shipping date: 10/1/2023 |
2023/10/01 |
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PCN(Product Change Notice)
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Description of Change: Die-bonding and resin materials will be changed for assembly location RSB (Renesas Semiconductor (Beijing) Co., Ltd). The new materials are already proven and used for other products in RSB assembly. No samples planned because the changed materials are already well known and used in mass production for other products.
Schedules: Change Implementation: b/o Oct. 2023 onwards
# Due to the large number of products covered by this notice, we have divided the notices. |
2024/04/01 |
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PCN(Product Change Notice)
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Change the lead frame. Target products: RX family RX110/RX13T/RX140/RX210/RX220/RX24T/RX24U LQFP-32/64pinLFQFP-100pin products Target post-processing base: Renesas Semiconductor (Beijing) Co., Ltd Expected shipping date: 7/1/2024 |
2024/07/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:EE-QR-240408-01 Title: Leadframe Change
Description of Change: Leadframe Change
Reason for Change: To ensure stable supply
Change Implementation: b/o Jul.2024 onwards |