2022/10/07 |
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PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 07-Oct-2022 |
2022/10/20 |
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PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 |
2022/10/20 |
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PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
2022/10/20 |
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PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
2022/10/20 |
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PCN(Product Change Notice)
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Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages Effectivity Date: 20-Oct-2022 (the earliest date that a customer could expect to receive changed material) |
2024/05/05 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 24_0009 Rev. - Title: Qualification of alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process
Description Of Change: Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to form, fit, function or reliability.
Effectivity Date: 05-May-2024 (the earliest date that a customer could expect to receive changed material) |