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Microsemi's New Libero SoC v11.6 Software Enhances Ease of Use for its Award-Winning SmartFusion2 SoC FPGAs and IGLOO2 FPGAs

2015/09/30Microsemi  Logic/PLD


New Software Also Extends Support for its RTG4 Radiation-Tolerant FPGAs

 

ALISO VIEJO, Calif., Sept. 29, 2015 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the release of its updated Libero system-on-chip (SoC) Version 11.6 comprehensive design software tool used for the development of the company's latest field programmable gate array (FPGA) products. In addition to the new support of its RTG4™ high-speed signal processing radiation-tolerant FPGA family for aerospace markets, Libero SoC v 11.6 also offers enhanced features for Microsemi's award-winning SmartFusion™2 SoC FPGAs and IGLOO™2 FPGAs. 

 

"The release of Libero SoC v 11.6 enhances ease of use for double data rate (DDR) and high-speed serial designs, with improved configurators and design efficiency improvements in global assignments and register retiming—resulting in faster time-to-market for designers of FPGA-based solutions," said Shakeel Peera, senior director of FPGA/SoC marketing for Microsemi. "RTG4 support now includes IO Advisor, SmartPower and uProm support, and takes advantage of other design optimization improvements in this release, demonstrating Microsemi's commitment to the space industry as the leading provider of FPGAs for the space market."


Microsemi's new Libero SoC v11.6 release automatically optimizes hold violations using minimum delay repair and provides advanced multi-pass options in layout for large designs. It optimizes power consumption with a new IO Advisor that reduces input and bi-directional I/O power. The new release also offers greater design efficiency with an improved design hierarchy browser and text editor features. In addition, it extends customer access to the advanced features of Microsemi's security devices by including them in the free Libero Gold license.


Other features include:


SmartPower interface support for RTG4 design-specific power analysis
SmartDebug interface support for Serializer/Deserializer (SerDes) and DDR blocks in SmartFusion2, IGLOO2 and RTG4
Place and route improvements in carry chain clustering and logic packing, resulting in a higher quality of results (QoR) with increased routability for larger designs
New multi-pass place and route options, which provide advanced control for difficult timing closure designs
"The SmartFusion2 and IGLOO2 families provide powerful differentiated silicon platforms," said Stefan Schutz, CEO and General Manager of Solectrix GmbH. "When combined with the productivity and ease of use gains that Libero SoC 11.6 release provides, it completes an excellent ecosystem for our developers to get to market quickly with mainstream industrial networking and imaging applications like the SXoM-SF2 solution (http://www.fpga.sx/system-on-a-chip-sxom-sf2.html) from Solectrix GmbH."


Additionally, Avnet, Inc., a leading global technology distributor, recently introduced a new SmartFusion2 KickStart Kit with Microsemi which utilizes the new Libero v 11.6 software.


"For Avnet's SmartFusion2 KickStart board, which features a secure M2S010S SoC, Libero 11.6 now allows use of the secure features with the free Gold licenses from Microsemi," said Tom Curran, technical marketing engineer, Avnet Electronics Marketing. "The tool flow is smooth, compilation times are down and productivity is up."


According to the Aberdeen group, by the year 2020 approximately 50 billion machines will be connected. Not only do these machines need to be secure, they need to be secured at the device, design and system levels. To enhance access for FPGA designers worried about secure FPGA designs, Libero v 11.6 introduces licensing changes to extend access for all users to popular security devices (005S and 010S) using the free Libero Gold license.


Availability
The Libero SoC v11.6 software toolset is now available for download from Microsemi's website at http://www.microsemi.com/products/fpga-soc/design-resources/design-software/libero-soc#downloads. For more information, visit http://www.microsemi.com/products/fpga-soc/design-resources/design-software/libero-soc#overview or contact sales.support@microsemi.com


About Microsemi's RTG4 FPGAs
RTG4 FPGAs bring new capabilities to the market and combine a wealth of features with the highest quality and reliability to meet the increasing demands of modern satellite payloads. The devices feature reprogrammable flash configuration, making prototyping easier for customers. RTG4's reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, without the configuration scrubbing required with SRAM FPGA technology. RTG4 supports space applications requiring up to 150,000 logic elements and up to 300 MHz of system performance. RTG4 is Microsemi's latest development in a long history of radiation-tolerant FPGAs that are found in many NASA and international space programs. For more information, visit http://www.microsemi.com/products/fpga-soc/radtolerant-fpgas/rtg4.


About Microsemi's SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements fo1r advanced security, high reliability and low power in critical industrial, military, aviation, communications and medical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM® CortexTM-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high-performance communication interfaces all on a single chip. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2.


About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA market by providing a LUT-based fabric, 5G transceiver, high-speed GPIO, block RAM, high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash-based fabric with the highest number of general purpose I/O, 5G SERDES interfaces and PCIe end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry. For more information visit: http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga.


About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.


Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.


"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation, statements related to its updated Libero SoC version 11.6 comprehensive design software used for the development of the company's latest FPGA products, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.


Logo - http://photos.prnewswire.com/prnh/20110909/MM66070LOGO


SOURCE Microsemi Corporation


For further information: Farhad Mafie, VP Worldwide Product Marketing, 949-380-6161, Beth P. Quezada, Director, Corporate Communications, 949-380-6102, Email: press@microsemi.com


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