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News Center

Commercialization Alliance and sheet-type development of VSI metamaterial heat dissipation sheet

2021/08/03Nichicon  Equipment and control components

 

Realization of world’s first revolutionary new heat dissipation sheet


June 22, 2021


 Okitsumo Incorporated (Okitsumo), NICHICON CORPORATION (“NICHCON”) and KISCO Ltd.(“KISCO”) have pooled their technological resources and formed a new operational alliance for the commercialization of “VSI*,” an aluminum metamaterial heat dissipation sheet. Okitsumo has been working for many years on research and development of this revolutionary heat dissipation solution. VSI is rewriting the conventional wisdom on heat solutions. By selectively radiating the infrared wavelength emitted by a device’s heat source, it enables heat to pass through the device’s resin housing to be released externally. (VSI is a registered trademark of Okitsumo.

 

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