2023/12/09 |
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PCN(Product Change Notice)
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Device symbolization update for Select Devices (Information Only) |
2023/12/15 |
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PCN(Product Change Notice)
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Texas Instruments Incorporated is announcing an update to device symbolization~marking for Select Devices |
2024/09/11 |
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PCN(Product Change Notice)
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Supplier Notice No.:20240903000.0 Title: Datasheet for PCF8575
Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated.
The datasheet number will be changing.
Device Family/ Change From:/ Change To: PCF8575 / SCPS121H / SCPS121I
These changes may be reviewed at the datasheet links provided. http://www.ti.com/product/PCF8575
Reason for Change: To accurately reflect device characteristics. The datasheet updates are driven by the changes announced in PCN 20240910001.1.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): No anticipated impact. This is a specification change announcement only. There are no changes to the actual device |
2024/12/10 |
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PCN(Product Change Notice)
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Supplier Notice No.:20240910001.1 Title: Qualification of RFAB using qualified Process Technologies, Die Revision, additional Assembly site (CDAT) and BOM options for select devices
Description of Change: Texas Instruments is pleased to announce the qualification of its RFAB fabrication facilities as additional Wafer Fab options in addition to a new assembly site (CDAT), & BOM options for the devices listed below. Additional Fab Site:RFAB Process:LBC7 Wafer Diameter:300 mm
Reason for Change: These changes are part of our multiyear plan to transition products from our 150-millimeter and 200-millimeter factories to newer, more efficient manufacturing processes and technologies, underscoring our commitment to product longevity and supply continuity.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive /negative): None |