| 2020/11/23 |
|
PCN（产品规格变更通知）
|
Early PCN: Several changes affecting Gen4 IGBT for Super TO-220. TO247. D2Pak packages :
Old New
metallization (specifically chip backside) Cr / Ni / Ag Al / Ti / Ni / Ag
metallization (specifically chip frontside) Al /Si Al / Si / Cu
wafer fab Infineon Technologies EPISIL Technologies Inc.
Americas Corp.,
Temecula, United States
leadframe -dimensions AUIRGDC0250:Single Gauge AUIRGDC0250:Dual Gauge
-finishing material AUIRGDC0250, AUIRG4BC30SSTRL: AUIRGDC0250, AUIRG4BC30SSTRL:
Ni plated in all area except die pad Bare Copper except Tpost
mold compound/encapsulation material AUIRGDC0250 Only: KMC2110G-7S AUIRGDC0250 Only: EME-G700HF
etc. |
| 2020/12/04 |
|
PCN（产品规格变更通知）
|
Introduction of new lead frame and lead finish material for dedicated products in TO247 package :
Old New
Lead finish material 99.3% Sn / 0.7% Cu 100% Sn
Lead finishing process Tin Dip Electro-plated
Lead frame design Heatsink hole design changed a little |
| 2021/04/30 |
|
PDN（产品停产通知）
|
Final PCN: Several changes affecting Gen4 IGBT for Super TO-220. TO247. D2Pak packages
PROCESS - WAFER PRODUCTION (specifically chip backside)
PROCESS - WAFER PRODUCTION (specifically chip frontside)
PROCESS - WAFER PRODUCTION: Move of all or part of wafer fab to a different location/site/subcontractor
PROCESS - ASSEMBLY: Change in leadframe dimensions
PROCESS - ASSEMBLY: Change of leadframe finishing material / area (internal)
PROCESS - ASSEMBLY: Change of mold compound / encapsulation material
PROCESS - ASSEMBLY: Change of product marking
PROCESS - ASSEMBLY: Change of specified assembly process sequence (deletion and/or additional process step)
PROCESS - ASSEMBLY: Move of all or part of assembly to a different location/site/subcontractor
PACKING/SHIPPING: Change of carrier (tray, reel)
TEST FLOW: Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor |
| 2021/11/15 |
|
PCN（产品规格变更通知）
|
Removal of legacy International Rectified (IR) logo from tube
and packing box affecting products from assembly location Rectificadores
Internacionales, S.A. de C.V., Tijuana , Mexico.
Reason: Standardization of packing material across Infineon sites
Description
Old: Outer packing box and plastic tube with legacy IR logo
New: Legacy IR logo removed from packing box and plastic tube |
| 2024/08/29 |
|
PCN（产品规格变更通知）
|
Supplier Notice No.:2023-252-A
Title:
Change of mold compound affecting products in package family TO220 and TO247
Reason/Motivation:
Infineon is ensuring business continuity and supply by moving on to ecologically aware and green mold compound
Description:
PROCESS - ASSEMBLY:Old/TIJ: Epoxy Resin A (TO220 & TO247) New/TIJ: Epoxy Resin B (TO220 & TO247)
Change of mold compound:Old/GTBF: Epoxy Resin A (TO247) New/GTBF: Epoxy Resin B (TO247)
encapsulation material:Old/TFME: Epoxy Resin C (TO220) New/TFME: Epoxy Resin D (TO220)
etc.
Anticipated impact of change:
Based on the qualification performed, Infineon does not see any negative impact on quality, function and reliability. No change in fit and form.
Last order date (LOD) [2]:
2024-08-29
[2] Last date where orders for unchanged products will be accepted.
|
| 2024/08/29 |
|
PCN（产品规格变更通知）
|
Infineon is ensuring business continuity and supply by moving on to ecologically aware and green mold compound |
