2021/07/31 |
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PCN(产品规格变更通知)
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Description of Change: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products - UTAC Thai Ltd., Bangkok, Thailand (UTL) List of changes : ▪ Table 1 – Adding UTL as alternate assembly site, Wire material change from Gold to Copper and Standardize Moisture Sensitivity Level to MSL3. ▪ Table 2 - Adding UTL as alternate assembly site. |
2021/08/18 |
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PCN(产品规格变更通知)
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This notice is an update to PCN20029 (which was published on Nov 02,2020). Renesas Electronics America (REA) will begin to use UTL(*) as alternate assembly of the listed Renesas DFN, QFN, TDFN, TQFN package products. (*)UTAC Thai Ltd., Bangkok, Thailand (UTL) |
2021/10/05 |
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PCN(产品规格变更通知)
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Correction of Moisture Sensitivity Level and Alternate bond wire material of the listed Renesas DFN, QFN, TDFN, TQFN packaged products Correction of Moisture Sensitivity Level and Alternate bond wire material the listed Renesas QFN packaged products - Carsem (M) Sdn, Bhd – S Site, Ipoh, Malaysia
List of changes : Table 1 Correction of Moisture Sensitivity Level, from MSL4 to MSL3. Table 2 Wire material change from Gold to Copper Table 2 Standardize Moisture Sensitivity Level from MSL1,2,3 to MSL3
Effective Date: 10/5/2021 |
2022/08/02 |
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PDN(产品停产通知)
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End Of Life Notice |
2022/08/25 |
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PDN(产品停产通知)
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The purpose of this notification is to communicate that Renesas Electronics has begun the End-of-Life (EOL) Process on select part numbers. |