2025/06/19 |
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PCN(产品规格变更通知)
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Introduction of Cu-wire bonding process for TSOP5-6 (SOT753-457) packages at ATSN (Nexperia Semiconductors Assembly & Test Plant Seremban Malaysia) - Replace Au (gold) wire with Cu (copper) wire in bonding process - No assembly location change - No diffusion fab location change - No wafer fab process change No change in form, fit, function, quality, workability and reliability anticipated |