2025/01/16 |
|
PCN(产品规格变更通知)
|
The die bond material for H8, H8S, H8SX, and SH family surface mount package products will be changed. Affected back-end processing base: Renesas Semiconductor (Suzhou) Co., Ltd (hereinafter referred to as [Suzhou]) The die bond material to be changed will be a material that has a proven track record in mass production at [Suzhou].
Scheduled start date of shipment: 5/1/2025 |