2021/02/09 |
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PCN(Product Change Notice)
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Manufacturing Change : a new lead frame design |
2021/12/01 |
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PCN(Product Change Notice)
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a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site. |
2022/02/01 |
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PCN(Product Change Notice)
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Product Change Notification Date: 01-Feb-2022
CCB 4539 Cancellation Notice: For the qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site |
2022/02/28 |
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PCN(Product Change Notice)
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Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:February 28, 2022 |
2022/03/30 |
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PCN(Product Change Notice)
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CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:March 30, 2022 |