2023/09/21 |
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PCN(Product Change Notice)
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Notice of Die Bond Material Change for H8, H8S and SH1/SH2 Family Surface Mount Package Products Affected back-end production site: Outsourced semiconductor assembly & test sites ("OSAT") Change: The die bond material is to be changed. Effective Date: 1/1/2024 |
2024/01/01 |
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PCN(Product Change Notice)
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Change of die bond material due to change of die bond material manufacturer Termination of the material supply by the current die bond material manufacturer |
2024/06/12 |
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PDN(Product Discontinuation Notice)
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Supplier Notice No.:SAF-B-24-0011 Title: End Of Life Notice(LTB_2025_06_30)
Overview: The purpose of this notification is to communicate that Renesas Electronics hasbegun the End-of-Life (EOL) Process on select part numbers.
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2024/06/13 |
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PDN(Product Discontinuation Notice)
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We will notify you of the EOL of our products. |
2025/01/16 |
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PCN(Product Change Notice)
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The die bond material for H8, H8S, H8SX, and SH family surface mount package products will be changed. Affected back-end processing base: Renesas Semiconductor (Suzhou) Co., Ltd (hereinafter referred to as [Suzhou]) The die bond material to be changed will be a material that has a proven track record in mass production at [Suzhou].
Scheduled start date of shipment: 5/1/2025 |