2022/07/08 |
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PCN(Product Change Notice)
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Qualification of new Fab site (RFAB) using qualified Process Technology, Die~Revision, and additional Assembly & BOM options for select devicess |
2022/09/27 |
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PCN(Product Change Notice)
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Texas Instruments is pleased to announce the qualification of a new fab & process technology (RFAB, LBC9) and Assembly & BOM option for selected devices as listed below in the product affected section. Construction differences are noted below: Current Fab Site: SFAB Process: HCMOS Wafer Diameter: 150mm Additional Fab Site: RFAB Process: LBC9 Wafer Diameter: 300mm Proposed 1st Ship Date: Sept 27, 2022 |
2022/10/20 |
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PCN(Product Change Notice)
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Datasheet for CDx4HC73, CD74HCT73, CDx4HC112, CDx4HCT112, CDx4HC688, CDx4HCT688 The product datasheet(s) is being updated |
2023/04/25 |
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PDN(Product Discontinuation Notice)
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Discontinuance of Select Logic Devices
Reason for Discontinuance: TI will no longer support certain tube and small reel packing variants for the following products. The recommended replacement products are exact devices shipped in large tape and reel. |