2021/09/13 |
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PCN (제품 변경 통지)
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Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM converting the top mark fromink to laser on ADI (legacy Linear Tech) products in all 8SOICNpackages assembled in ADPG, UTACandCarsem. |
2021/10/07 |
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PCN (제품 변경 통지)
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Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM As part of continuous quality improvement program we will be converting the top mark from ink to laser on ADI (legacy Linear Tech) products in all 8SOICN packages assembled in ADPG, UTAC and Carsem.
Publication Date: 05-Jul-2021 |
2022/11/14 |
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PCN (제품 변경 통지)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package Effectivity Date: 14-Nov-2022 |
2022/11/14 |
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PCN (제품 변경 통지)
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Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2) Rev. A 14-Nov-2022 14-Nov-2022 Adding additional parts Effectivity Date: 14-Nov-2022 (the earliest date that a customer could expect to receive changed material) |
2025/01/10 |
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PCN (제품 변경 통지)
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Revision Description: Initial Release. Description Of Change: Migrating bottom trace code marking to top side package laser mark. Reason For Change: To standardize the marking method with other packages across the company and align with industry environmental initiatives. |