2021/07/31 |
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PCN (제품 변경 통지)
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Description of Change: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products - UTAC Thai Ltd., Bangkok, Thailand (UTL) List of changes : ▪ Table 1 – Adding UTL as alternate assembly site, Wire material change from Gold to Copper and Standardize Moisture Sensitivity Level to MSL3. ▪ Table 2 - Adding UTL as alternate assembly site. |
2021/08/18 |
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PCN (제품 변경 통지)
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This notice is an update to PCN20029 (which was published on Nov 02,2020). Renesas Electronics America (REA) will begin to use UTL(*) as alternate assembly of the listed Renesas DFN, QFN, TDFN, TQFN package products. (*)UTAC Thai Ltd., Bangkok, Thailand (UTL) |
2021/10/05 |
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PCN (제품 변경 통지)
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Correction of Moisture Sensitivity Level and Alternate bond wire material of the listed Renesas DFN, QFN, TDFN, TQFN packaged products Correction of Moisture Sensitivity Level and Alternate bond wire material the listed Renesas QFN packaged products - Carsem (M) Sdn, Bhd – S Site, Ipoh, Malaysia
List of changes : Table 1 Correction of Moisture Sensitivity Level, from MSL4 to MSL3. Table 2 Wire material change from Gold to Copper Table 2 Standardize Moisture Sensitivity Level from MSL1,2,3 to MSL3
Effective Date: 10/5/2021 |
2022/08/02 |
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PDN(제품 단종 통지서)
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End Of Life Notice |
2022/08/25 |
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PDN(제품 단종 통지서)
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The purpose of this notification is to communicate that Renesas Electronics has begun the End-of-Life (EOL) Process on select part numbers. |