2020/09/08 |
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PCN (제품 변경 통지)
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Packaging Assembly site: ROHM Wako, ROHM-Wako Electronics (Malaysia) Sdn.Bhd. , ROHM Semiconductor (China) Co.,Ltd. After: Additional Assembly production: Wafer production site: ROHM, ROHM HAMAMATSU , ROHM APOLLO, ROHM WAKO Packaging Assembly site:PANJIT-China, PANJIT-Taiwan Reason: In order to enhance supply capacity by adding outsourced assembly manufacturing bases due to production restrictions at the package assembly factory (Malaysia factory) |