Enables Layout without Multi-Layer PCB for Cost Saving

 

June 14, 2013

 

TOKYO - Toshiba Corporation (TOKYO: 6502) today announced that it has expanded its package line-up of interface-converter bridge LSIs for high resolution LCD display that are used in tablet PC, Ultrabooks™ and other applications. Mass production of "TC358778XBG" is scheduled to start in June, followed by "TC358777XBG" in July.

 

The ball pitch of the original product is 0.4mm, and fine pitch assembly equipment is required for production. Expanding the ball pitch from 0.4mm to 0.65mm achieves assembly with no need for such equipment. Toshiba has also optimized the pin assignment for layout without high cost PCB with more than 4 layers.

 

Those new package products reduce the set makers' cost of assembly and materials.

 

 

Key Features

■Ball pitch expanded from 0.4mm to 0.65mm
■Optimized pin assignment allows layout with no need for high cost PCB with more than 4 layers

 

 *: Ultrabook™ is a trademark of Intel Corporation in the US and/or other countries.

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

 

 

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0614&no=02

 

 

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://www.semicon.toshiba.co.jp/eng/index.html?mm=cp0614&no=02

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• STMicroelectronics’ failsafe comparators with guaranteed start-up time boost reliability and power savings

  2024/12/03  STMicroelectronics  Analog

• Flexible, space-saving class-D amplifier for in-car audio, from STMicroelectronics, adds automotive-optimized diagnostics

  2024/09/30  STMicroelectronics  Analog

• ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

  2024/04/23  STMicroelectronics  Analog

• STMicroelectronics’ SiC-based digital power solution selected by Compuware for high-efficiency and reliable server power supply

  2024/04/02  STMicroelectronics  Analog

• STMicroelectronics boosts silicon power performance with automotive-grade MDmesh DM9 super-junction MOSFETs

  2024/03/18  STMicroelectronics  Analog