STMicroelectronics Home-Networking Solution Receives MoA 2.0 Certificationa 2015/06/12 STMicroelectronics
Network/Telecommunication
The certified solution addresses Gateway, Set Top Box, and home network bridge markets Geneva / 27 5 2015
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announces that its STiC2BB+STiC2PA home-networking reference design has received the MoCA® (Multimedia over Coax Alliance) 2.0 interoperability certificate1. ST’s MoCA 2.0-certified solution delivers the highest standard in home networking, boosting speed, power efficiency, and capacity for a multi-room HD and Ultra-HD experience.
ST’s highly integrated and very-low-power home-networking product can enable a multitude of MoCA 2.0-capable devices, stimulating the consumption of rich multimedia content within the whole home. The certified solution is available and has already been selected by several leading equipment manufacturers.
“In the dynamic and competitive Consumer industry, ST continues to be a leading provider of solutions based on the MoCA technologies. The MoCA 2.0 certification confirms ST’s strong expertise in the home-networking space and its commitment to being a reference partner for Multiple Service Operators (MSOs) in opening new business opportunities,” said Thomas Meyer, Headless Product Line Manager, Consumer Product Division, STMicroelectronics.
The STiC2BB+STiC2PA reference development boards and Host software are available now, enabling rapid design of MoCA 2.0-based prototypes and products.
To learn more about the ST MoCA 2.0 solution and associated reference designs, please get in touch with your local ST contact or visit www.st.com/stic2bb and www.st.com/stic2pa
Further Technical Information:| The MoCA 2.0 standard supports throughput of 400Mbps in single-channel Baseline performance mode, with a Turbo mode that increases throughput to over 500Mbps. ST’s solution provides full support for these modes, including the addition of bonding that supports 800 Mbps throughput in an Enhanced mode and 1Gbps throughput in Turbo mode. With the support of a packet loss rate lower than 1x10-8 and with the possible latency reaching 2.4msec on average for low latency flows, MoCA 2.0 also improves both video delivery and gaming experience, simultaneously.
In addition, enhanced power management in the STiC2BB introduces a reduced-power standby mode with wake-on-MoCA capability for fast response. Per MoCA2.0 standard specifications, there are also a minimum-power sleep mode and a network-level standby mode that reduces power for all nodes.
The ST MoCA 2.0 Interoperability certificate can be accessed at http://www.mocalliance.org/products/index.htm
About STMicroelectronics| ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power and automotive products and embedded processing solutions. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented.
In 2014, the Company’s net revenues were $7.40 billion. Further information on ST can be found at www.st.com .
1for Ethernet to MoCA 2.0 bridge
Visit Chip1Stop Chinese site Visit Chip1Stop Korean site Visit Chip1Stop English site Visit Chip1Stop German site
Companies Website:
http://www.st.com/
STMicroelectronics News Release
2024/12/24 STMicroelectronics
Processor/Memory
2024/12/24 STMicroelectronics
IoT
2024/12/13 STMicroelectronics
Company / Market Trends
2024/12/13 STMicroelectronics
Company / Market Trends
2024/12/12 STMicroelectronics
Equipment and control components
Related News Release
2024/10/28
STMicroelectronics
Network/Telecommunication
2024/10/03
Bourns
Network/Telecommunication
2024/08/28
WIZnet
Network/Telecommunication
2024/04/05
STMicroelectronics
Network/Telecommunication
2023/06/26
STMicroelectronics
Network/Telecommunication