2023/09/28 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Effectivity Date: 28-Sep-2023 (the earliest date that a customer could expect to receive changed material) |
2024/02/08 |
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PCN(Product Change Notice)
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Package Outline Drawing and Data Sheet Revision for Select LFCSP Products in Amkor Revision Description: 1) Update Package Outline Drawing List Attachment and Device list. 2) Removed parts. AD9239BCPZ-170 AD9239BCPZ-250 AD9639BCPZ-170 AD9639BCPZRL-170 AD9780BCPZ AD9780BCPZRL AD9781BCPZ AD9781BCPZRL AD9783BCPZ AD9783BCPZRL |
2024/05/05 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 24_0009 Rev. - Title: Qualification of alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process
Description Of Change: Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to form, fit, function or reliability.
Effectivity Date: 05-May-2024 (the earliest date that a customer could expect to receive changed material) |
2025/02/14 |
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PCN(Product Change Notice)
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Supplier Notice No.:PCN 24_0009 Rev. D Title: (Remove part)Qualification of Alternative Wafer Fab for TSMC 0.18um Mixed Signal CMOS Process
Description Of Change: Analog Device is adding Analog Devices Beaverton OR, USA (ADBN) as an alternate Wafer Fab site to TSMC Taiwan for 0.18um Mixed Signal CMOS Process.
Reason For Change: This change will ensure manufacturing agility and continuity of supply.
Impact of the change (positive or negative) on fit, form, function & reliability: There is no impact to form, fit, function or reliability.
Revision Description: Remove part. |