2020/12/16 |
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PCN(Product Change Notice)
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NXP Will Add a Sealed Date to the Product Label * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. PP0000724692/93/94/95/96/98 |
2022/09/15 |
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PCN(Product Change Notice)
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Maintaining Final Test Second Source Capability: ATTJ to ATTJ-B2 Qualification Results Effective date:Sep 15, 2022 |
2023/08/23 |
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PCN(Product Change Notice)
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NXP Semiconductors announces the qualification of a stamped leadframe, replacing the current etched leadframe, for the SOIC 32 lead exposed pad devices associated with this notification. The stamped leadframe products are now qualified for assembly at NXP-ATTJ assembly site, Tianjin China. No change to leadframe base metal material, plating or overall dimensions - except for minor change to exposed pad area shape - but with no impact to exposed pad overall dimensions. |
2023/09/08 |
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PCN(Product Change Notice)
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New MC33972 data sheet revision 20.0 and new MC33975 data sheet revision 12.0 are now available. |