・Industry’s largest memory size - 2 Mbits

・Smallest standard package UFDFPN5

・Smallest WLCSP package  

・A guarantee at 4 million erase/write cycles and 200 years data retention

・The 3 major bus types

　・M24 Series I²C up to 2 Mbits, up to 1 MHz bus

　・M95 Series SPI, to 2 Mbits, up to 20 MHz bus, Chip Select

　・M93 series Microwire up to 16 Kbits

・Miniature packages (WLCSP, UFDFPN8, UFDFPN5) and small packages (S08, TSSOP8)

・Operating voltage from 5.5 V to 1.7 V, (even 1.6 V for some parts)

・Specific features

　・Lockable Identification Page (I²C or SPI bus),

　・Programmable block protection (Microwire bus)

・IBIS and Verilog models are available in Design Resources for Standard Serial EEPROM and Automotive EEPROM

UFDFPN5 smallest standard EEPROM

During recent years, ST conducted research on next-generation Chip-Size Packaging (CSP). The UFDFPN5 (also known as MLP5) is a near CSP plastic encapsulated package using conventional copper lead frame technology in an extremely compact, lightweight package.The M24C16-FMH6TG, uses UFDFPN5 package with 60% size reduction (1.4 x 1.7 mm).