April 27, 2015

TOKYO—Toshiba Corporation’s (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of a low-input current drive transistor output photocoupler in a low-height SO6L package, which can be used to replace conventional DIP4 pin package products. The new product, "TLP383", starts shipments from today.
 

The new product incorporate Toshiba's original high output infrared LEDs and guarantee the same CTR (Current Transfer Ratio) at 0.5mA input current and at 5.0mA input current.
 

The new photocoupler has a low height of 2.3mm (max), an approximately 45% reduction from  Toshiba conventional DIP4 package products. At the same time, the new product has an isolation specification equivalent to DIP4 wide lead type package products and guarantees a creepage and clearance distance of 8mm (min), and isolation voltage of 5000Vrms (min). With its low height, the "TLP383" can be used in situations where there are strict height restrictions, such as on motherboards, and contribute to the development of smaller sets. It can be used for applications including inverter interfaces and general-purpose power supplies.
 

Key Specifications of New Product

[Note] Corresponds to each CTR rank, such as GR and GB. Please check the datasheet for details.
 

Follow this link for more on Toshiba transistor-output photocouplers.
http://toshiba.semicon-storage.com/ap-en/product/opto/photocoupler.html?mm=cp150427&no=09
 

＊Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

 
Toshiba Corporation- Semiconductor and Storage Products Company　Website＞http://toshiba.semicon-storage.com/ap-en?mm=cp150427&no=10

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp150427&no=10

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• STMicroelectronics’ failsafe comparators with guaranteed start-up time boost reliability and power savings

  2024/12/03  STMicroelectronics  Analog

• Flexible, space-saving class-D amplifier for in-car audio, from STMicroelectronics, adds automotive-optimized diagnostics

  2024/09/30  STMicroelectronics  Analog

• ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

  2024/04/23  STMicroelectronics  Analog

• STMicroelectronics’ SiC-based digital power solution selected by Compuware for high-efficiency and reliable server power supply

  2024/04/02  STMicroelectronics  Analog

• STMicroelectronics boosts silicon power performance with automotive-grade MDmesh DM9 super-junction MOSFETs

  2024/03/18  STMicroelectronics  Analog