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STMicroelectronics reveals automotive-grade inertial modules for cost-effective functional-safety applications up to ASIL B

2024/05/24STMicroelectronics  Automotive

Deliver high accuracy and reliability in vehicle navigation, body electronics, and automated driving systems

Geneva, Switzerland, May 6, 2024 – STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.

The ASM330LHBG1 is AEC-Q100 Grade-1 qualified for the ambient operating temperature range -40°C to 125°C, allowing use such as next to the engine compartment and in areas exposed to sunlight. The modules deliver high accuracy and reliability for systems such as vehicle navigation, body electronics, in driver support and highly automated driving systems. Typical uses include support for precise positioning in navigation systems, digitally stabilizing cameras, lidars, and radars, and in active suspension, door modules, vehicle-to-everything (V2X) applications, adaptive lighting, and motion-activated functions.

Equipped with ST’s machine-learning core (MLC) and programmable finite state machine (FSM), the ASM330LHBG1 can run artificial intelligence (AI) algorithms in the sensor to provide smart functionality at very low power. This IMU is pin-to-pin compatible and shares the same configuration of registers as ST’s automotive IMUs with a lower operating temperature range, permitting a seamless upgrade.

In addition, the modules contain embedded temperature compensation, which ensures stability over wide-ranging operating conditions, and provide a six-channel synchronized output to enhance the accuracy of dead-reckoning algorithms. There are also I²C, MIPI I3C, and SPI serial interfaces, smart programmable interrupts, and a 3KB FIFO that eases managing sensor data to minimize load on the host processor.

The independently tested and certified software adheres to ISO26262 and enables safety-compliant redundancy with two ASM330LHBG1 modules. Fulfilling safety element out of context (SEooC), this combination based on general-purpose hardware supports system certification up to automotive safety integrity level B (ASIL B)※1. This library provides software for configuring the sensing module, checking for correct operation before starting to acquire data, and handling the acquisition of the data coming from the sensing module. Each of these steps is associated with an error code that provides confirmation if a fault is detected. This solution comprising two identical sensors provides redundancy, checking the data coming from two different sensing sources are consistent.

The ASM330LHBG1 is in production now and available in a 14-lead, 2.5mm x 3mm VFLGA plastic land grid array package. Budgetary pricing is $9.40 for orders of 1000 pieces.

Please visit https://www.st.com/safer-driving-smarter-life for more information.

※1 ASIL B is the second level of independence within the ASIL (Automotive Safety Integrity Level) risk classification scheme defined by the ISO 26262 - Functional Safety for Road Vehicles standard

About STMicroelectronics 
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.


Companies Website:
http://www.st-japan.co.jp

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