Delivering industry-leading signal integrity and density while providing a scalable price and performance path for future data-rate enhancements, the Impel™ system of backplane connectors and customized cable assemblies offers OEMs the option for equipment to operate at today’s data rates and costs

Leading the datacom computing marketing with high-data-rate and -density solutions, the Impel™ Backplane Interconnect System provides a scalable price-for-performance solution enabling customers to secure a high-speed 25 and 40 Gbps footprint.

Customers are currently designing new high-end system architectures that will require data-rate improvements. The Impel™ Backplane Interconnect System provides the footprint and interface that will enable customers to migrate to faster data rates (40 Gbps), without completely re-designing their architecture or replacing hardware already placed in the data-center, while meeting the mechanical density requirements being driven by the industry.

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Molex News Release

• Molex| ML-XT™ Sealed Connection System

  2015/08/14Molex  Passive / Connections / mechanical parts

• Molex and Newly-Acquired Oplink to Demonstrate Innovative Transmission and Transport Solutions at OFC 2015

  2015/04/21Molex  Company / Market Trends

• Molex FPC Connectors, 0.30mm Pitch, SMT, Dual Contact, Easy-On™ BackFlip™ Actuator

  2015/03/24Molex  Passive / Connections / mechanical parts

• Molex | SlimStack™ SSB6 Board-to-Board Connectors, SMT, 0.35mm Pitch, 0.60mm Height, 2.00mm Width, Revision 1

  2015/02/13Molex  Passive / Connections / mechanical parts

• Molex Honored to Receive "Excellent Core Partner" Award 2014 from Huawei Technologies

  2015/01/23Molex  Company / Market Trends

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