Toshiba’s New ICs for Bluetooth® Smart Devices Feature Built-in Flash ROM 2015/11/18 Toshiba
RF & Micro Wave
Will Promote Adoption of Communication Functions for Wearables
November 17, 2015
TOKYO – Toshiba Corporation (TOKYO: 6502) today announced the launch of two Bluetooth® ICs, that both support Bluetooth® Low Energy (LE)[1] ver.4.1 communications. The “TC35676FTG/FSG” integrates built-in Flash ROM, while the “TC35675XBG” supports both Flash ROM and NFC Forum Type 3 Tag for peer-to-peer communication. Sample shipments start today.
The “TC35676FTG/FSG” adds to the current “TC35667FTG/FSG” line-up launched last year. These devices realize low power consumption with an original low-power circuit design and integration of a highly efficient DC-DC converter. The new IC builds on these with the addition of Flash ROM to store user programs and various data for stand-alone uses. The new IC also has a 64KB user program area, achieved by increasing the internal SRAM size that allows its internal ARM® processor to execute various kinds of application programs.
The “TC35675XBG” is an addition to the “TC35670FTG” line-up. Integrated into a product, its NFC Tag realizes easy Bluetooth® peer-to-peer paring and easy power on/off functions simply by touching another NFC supported mobile device, extensions of the “TC35676FTG/FSG” functions.
The new ICs will boost cost performance, as the built-in Flash ROM eliminates any need for an external EEPROM and reduces external part counts and PCB size. They also have the same low power consumption feature as the current ICs and operate long operating times for applications powered by small coin cell batteries. For example, using a CR2032 type coin battery, the new ICs can carry out beacon operation for more than six months[2].
The new ICs will facilitate adoption of Bluetooth® LE communications for high grade small devices, such as wearable healthcare devices, sensors and toys, and will support set makers in optimizing product value.
Key Features
・Low power consumption: Less than 6mA at peak consumption (@3.3V, -4dBm Transmitter output power or Receiver operation) Less than 100nA in deep sleep (@3.3V) ・Receiver sensitivity: -92.5dBm ・Supports Bluetooth® LE central and peripheral devices ・Built-in GATT (Generic Attribute Profile) ・Supports servers and client functions defined by GATT (Generic Attribute Profile) ・Built-in 192KB Flash ROM ・Built-in NFC Forum Type 3 Tag chip. (FeliCaTM Lite-S compatible) [3] (TC35675XBG only) ・Automatic CRC generation during writing data to Tag chip, automatic checking during reading data from Tag chip, Relay function from Wired to Wireless / Wireless to Wired
Applications
Bluetooth® Smart devices[4], such as wearable devices, healthcare devices, smart phone accessories, remote controllers, and toys.
Main Specifications
Notes: [1] Low power consuming communication technology defined as Bluetooth® Ver. 4.1. [2] Length of battery life depends on the frequency of beacon output. [3] FeliCaTM is a contactless IC card technology developed by Sony Corporation. TC35675XBG is designed using FeliCaTM Lite-S technology licensed by Sony Corporation. [4] Devices that adopt Bluetooth® core specification Ver. 4.1 or higher with low energy core configuration, and that use GATT (General Attribute Profile) based architecture specified in Bluetooth® Ver.4.0.
* Bluetooth SIG owns the registered trademark, Toshiba uses it under license. * ARM is a registered trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. * All other trademarks and trade names are properties of their respective owners.
Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Toshiba Corporation- Semiconductor and Storage Products Company Website>
http://toshiba.semicon-storage.com/ap-en?mm=cp151118&no=02
Visit Chip1Stop Chinese site Visit Chip1Stop Korean site Visit Chip1Stop English site Visit Chip1Stop German site
Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp151118&no=02
Toshiba News Release
2024/11/13 Toshiba
Automotive
2024/11/01 Toshiba
Automotive
2024/10/28 Toshiba
Automotive
2024/09/26 Toshiba
Power Supply
2024/09/05 Toshiba
Automotive
Related News Release
2023/12/11
STMicroelectronics
RF & Micro Wave
2023/02/22
STMicroelectronics
RF & Micro Wave
2022/07/12
Nisshinbo Micro Devices
RF & Micro Wave
2018/01/29
Toshiba
RF & Micro Wave
2018/01/10
Toshiba
RF & Micro Wave